Renovation of an educational facility in Oxford, Indiana. Completed plans call for the renovation of a educational facility.

The successful bidder shall, upon acceptance of his bid, be required to procure and pay for a Contractor's Bond for Construction (Form 86A or AIA Form A312) in an amount equal to 110 percent of his contract price. In the case of the School Corporation, such bonds shall comply with all laws of the State of Indiana governing public contracts let by governmental units. Bids should be enclosed in a sealed envelope, addressed to the School Corporation, with the name of job and name and place of business of the bidder to which the bid relates on the envelope, all as more particularly set forth in the Instructions to Bidders. Bids submitted by mail should be addressed to Dr. Scott Van Der Aa, Superintendent, 405 S. Grant Avenue, Fowler, Indiana 47944. Bids should be made on the form included in the Project Manual which is based on the Indiana State Board of Accounts Form 96 (Revised 2013), and shall be accompanied by an acceptable certified check, cashier's check, or bid bond, executed by the bidder and an acceptable surety company, payable to the order of the School Corporation, in an amount not less than five percent (5%) of the total bid. In the event any bidder withdraws his bid or fails to execute a satisfactory contract or contracts and furnish a satisfactory performance bond or bonds within ten (10) days after a contract or contracts has been awarded to such bidder by the School Corporation, said School Corporation may declare his certified check or cashier's check or bid bond forfeited to said School Corporation as liquidated damages. The School Corporation shall have the right: to accept any Bid within sixty (60) days after the time of opening of the Bids, during which time no Bids shall be withdrawn; at any time to reject any and all Bids; and to waive all formalities or irregularities in the bidding. Contractors will be required to complete their work within a certain specified period as provided in Section 01 11 00 of the specifications.