Site work and paving for a civil project in Indian Island, New Brunswick. Completed plans call for site work for a bridge / tunnel; for paving for a road / highway; road / highway; and water / sewer project.

Indian Island First Nation (IIFN) has received confirmation of funding from Indigenous Services Canada (ISC) for road upgrades to Mi'kmaq Lane, which is a 660 m long chip seal road with ditches, located between Island Drive and Barlow Trail. The goal of the project is to replace the road to make it more durable, improve drainage conditions, minimize annual operation and maintenance needs, and improve the driving conditions for Indian Island community members. Upgrades will include improvements to ditching, rebuilding the subbase/road surface, the installation of drainage infrastructure at both ends of Mi'kmaq Lane, and the construction of a seawall outfall. Upgrades will also include improvements to Indian Island Drive, which will consist of new cross-culverts at the intersections with Mi'kmaq Lane and Barlow Trail, new driveway culverts and associated ditch regrading, and a new outfall ditch. The scope of work includes the supply and installation of culverts, roadway excavation and supply and installation of road granulars and chips seal, the supply and install of an outfall culvert, the construction of a new outfall ditch, construction of new ditches and cleaning out existing ditches, the supply, installation and maintenance of erosion control, and property restoration work, as further detailed in the drawings and specifications. All queries and submissions during the Bid period should be submitted to the Owners Representative by email only at: jennifer.glasgow@colliersprojectleaders.com, Subject line: IIFN Road Upgrades Tender - Inquiries Within five (5) business days following the notification of award, the successful Bidder shall submit an Agreement to Bond from a Canadian surety company, stating that the surety is willing to supply a Performance Bond in the amount of 50% of the Bid Price and a Labour and Material Payment Bond in the amount of 50% of the Bid Price. Bid value not released for publication.