Site work and new construction of an educational facility in State College, Pennsylvania. Completed plans call for the construction of a educational facility; and for site work for a educational facility.

**As of September 30, 2025, this project has not yet been awarded. A timeline for the award has not yet been established.** *This project package was put out for Design-Assist request on January 09, 2025. As of March 10, 2025, this package could go out to bid by the end of March 2025. Tentative construction start date for this project is slated for July 2025, and is expected to be completed in June 2026. Construction of the new micro electronic systems packaging research laboratory. he Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost. Package Name DA Mechanical and Plumbing, DA Electrical