Wyoming (WY)

Thermopolis

Thermopolis - 2026 Chip Seal Project - 6215985

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Publicly Funded

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Published July 28, 2026 at 8:00 PM

Updated July 30, 2026

Description

Site work and paving for a road / highway in Thermopolis, Wyoming. Completed plans call for paving for a road / highway; and for site work for a road / highway.

Chip seal construction project including materials, labor, services, and transportation. Bonds: 5% Bid Bond, 100% Performance Bond, 100% Payment Bond. *The value for this project is based on a financial range. The value is listed as the highest possible cost from the range provided by a stakeholder or official project document. The Engineer's opinion of probable construction costs ranges from $110,000 to $ 140,000. Bidder shall submit all questions about the meaning or intent of the Bidding Documents to Engineer in writing. Interpretations or clarifications considered necessary by Engineer in response to such questions will be issued by Addenda delivered to all registered plan holders. Questions received less than seven days prior to the date for opening of Bids may not be answered.

Details

Stage

GC Bidding

Value

$140,000.00

Sector

Public - City

Bonds

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Bid Date

August 3, 2026

Start Date

September 2, 2026

Location

420 Broadway St, Thermopolis, WY

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United States of America

Thermopolis - 2026 Chip Seal Project - 6215985

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