Wyoming (WY)

Thermopolis

{ "title": "Thermopolis 2026 Chip Seal Project - 6225258

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Published July 25, 2026 at 8:00 PM

Updated July 27, 2026

Description

Paving for a road / highway in Thermopolis, Wyoming. Completed plans call for paving for a road / highway.

Chip sealing sections of 5th Street through Thermopolis, including materials, labor, services, and transportation. Bonds: 5% Bid Bond, 100% Performance Bond, 100% Payment Bond.

Details

Stage

GC Bidding

Value

$140,000.00

Sector

Public - City

Bonds

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Bid Date

August 3, 2026

Start Date

September 17, 2026

Location

5th Street, Thermopolis, WY

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United States of America

{ "title": "Thermopolis 2026 Chip Seal Project - 6225258

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